SSD Solution

Enterprise SATA 3.0 and NVMe Data Center (DC) SSDs are designed with a stringent set of development requirements and a thorough testing process. This results in consistency for workloads requiring a balance of high random read-and-write IOPS performance. Power-failure features keep mission-critical environments up and running all day, every day.

 

In the SSD Solution, the focus is on everything ultrathin—sleek, thin, and fast Ultrabook™ devices, ultrathin clients, convertibles, and tablets. Get outstanding random write performance, enhanced endurance, and robust features at a competitive price for DIY and enterprise pre-setting service company with our SSD solution. SSD devices connect our lives, looking for by leveraging our low-power, high performance memory, extensive technical expertise, and dedication to collaboration for your next design. Industrial SSD deliver optimal performance, high capacities, increased reliability and industrial temperature options in small form factors.

 

SSD (Solid State Drive) performance and reliability rely heavily on all of the drive’s parts—the controller, the firmware, and the NAND Flash itself—working and playing nicely together. Well-thought-out and strategic Flash management helps this SSD works well. Improving SSD Performance Through Better Flash Management, careful attention to several factors contributes to better NAND Flash management—amping up performance and turning down the latency of SSDs:

·         Background operations integration − Keeping these operations out of the way of host I/O requests

·         Efficient garbage collection − Timing is everything

·         DRAM data protection − Making sure what is read back is really what was written

 

Our SSD solutions already have features built in to address these needs. For example, our SSDs have the special feature set that improves both performance and reliability. We devote significant SSD solution so that our customers can forget about production, or trial run hundred of FLASH types or match different controller types to waste time and move on to more important things—like running their businesses and making money.

Made for the big demands of enterprise-class applications, our SSD solutions deliver high performance and reliability, superior data protection, and optimal endurance to support the enterprise infrastructure.

 

Solution Overview

The Solid State Drive (SSD) is fully consists of semiconductor devices using NAND Flash Memory which provide high reliability and high performance for a storage media. The SSD doesn't have any moving parts such as platter (disk) and head media, which provides a better solution in a notebook，desktop PC, All-in-one PC, Gaming PC and POS as a storage device providing higher performance, reduced latencies, and a low power consumption in a small form factor. The SSD could also provide rugged features in industrial PC with an extreme environment with a high MTBF.

 

1.      Product Specifications

 

1.1          Capacity

User Addressable Sectors

	Unformatted Capacity (Total User Addressable Sectors in LBA Mode)
60GB	117,231,408
120GB	234,441,648
240GB	468,862,128
500GB	976,773,168

Notes:  1 GB = 1,000,000,000 bytes; 1 sector = 512 bytes.

LBA count shown represents total user storage capacity and will remain the same throughout the life of the drive.

The total usable capacity of the SSD may be less than the total physical capacity because a small portion of the capacity is used for NAND flash management and maintenance purposes.

 

1.2  Performance

The data compression engine in the SSD controller optimizes performance based on the data pattern of the workload.

This section provides both compressible and incompressible Input/Output Operations Per Second (IOPS) and sustained sequential read and write bandwidth specifications.

 

1.2.1  Compressible Performance

*AS SSD Benchmark1.7  using out-of-box SSD

Specification	Unit	SSD
		64 GB	128 GB	256 GB	512GB
Sequential Read	MB/s	469.69	524	518	502.17
Sequential Write	MB/s	84.94	136	257	386.30
Random 4 KB Reads SEQ1	IOPS	7,055	6,487	6,392	5,141
Random 4 KB Writes SEQ1	IOPS	15,993	13,992	14,138	10,878

 

*PCMARK8 Professional Edition  using out-of-box SSD

Specification	Unit	SSD
		64 GB	128 GB	256 GB	512 GB
Storage SCORE	---	4843	4893	4938	4963
Storage bandwidth	MB/s	171.05	193.28	223.48	249.44
World of Warcraft	s	58.5	58.6	58.6	58.3
Battlefield 3	s	134.0	133.9	133.8	133.4
Adobe Photoshop light	s	119.3	117.0	114.7	114.1
Adobe Photoshop heavy	s	387.2	374.7	364.5	360.9
Adobe InDesign	s	62.0	60.0	58.4	57.7
Adobe After Effects	s	70.9	70.9	70.9	70.7
Adobe Illustrator	s	72.7	72.4	72.2	72.0
Microsoft Word	s	28.8	28.6	28.4	28.3
Microsoft Excel	s	9.3	9.3	9.3	9.2
Microsoft PowerPoint	s	9.4	9.3	9.3	9.2
Benchmark duration	--	1h9min44s	1h9min12s	1h10min53s	1h21min10s

Note：

1.         Test platform： INTEL Core i5-3550, ASUS P8Z77-V LX ,4GB DDR3 1600, Windows 7 SP1

2.         Test data depending on the software / hardware platform, is for reference only, not as a business or contract offer.

 

2.  Electrical Characteristics

Operating Voltage for 2.5-inch Form Factor

Electrical Characteristics	SSD
	60GB,120GB,240GB,500GB
5 V Operating Characteristics: Operating Voltage range Rise time (Max/Min) Fall time (Min) Noise level   Min Off time Inrush Current (Typical Peak)	5 V (±5%) 1 s / 1 ms 1 ms 500 mV pp 10 Hz – 100 KHz 50 mV pp 100 KHz – 20 MHz 500 ms 1.0 A, < 1 s

Notes:

1.       Measured from initial device power supply application.

2.       Fall time needs to be equal or better than minimum in order to guarantee full functionality of enhanced power loss management.

3.       The drive needs to be powered off for at least 500msec before powering on.

 

2.1  Environmental Conditions

2.1.1  Temperature, Shock, Vibration

Temperature	Range
Case Temperature Operating Non-operating	0 – 70℃ -55℃ to 90℃
Temperature Gradient Operating Non-operating	30℃/hr (Typical) 30℃/hr (Typical)
Humidity Operating Non-operating	5 – 95% 5 – 95%
Shock and Vibration	Range
Shock Operating Non-operating	1,000 G (Max) at 0.5 msec 1,000 G (Max) at 0.5 msec
Vibration Operating Non-operating	2.17 GRMS (5-700 Hz) Max 3.13 GRMS (5-800 Hz) Max

Notes:

1.   Please contact your sales representative for details on the non-operating temperature range.

2.   Temperature gradient measured without condensation.

3.   Shock specifications assume the SSD is mounted securely with the input vibration applied to the drive-mounting screws. Stimulus may be applied in the X, Y or Z axis. Shock specification is measured using Root Mean Squared (RMS) value.

4.  Vibration specifications assume the SSD is mounted securely with the input vibration applied to the drive-mounting screws. Stimulus may be applied in the X, Y or Z axis. Vibration specification is measured using RMS value.

 

2.2  Reliability

The SSD meets or exceeds SSD endurance and data retention requirements as specified in the JESD218 standard. Reliability specifications are listed in the table below:

 

2.2.1  Reliability Specifications

Parameter	Value
Uncorrectable Bit Error Rate (UBER)   Uncorrectable bit error rate will not exceed one sector in the specified number of bits read. In the unlikely event of a non-recoverable read error, the SSD will report it as a read failure to the host; the sector in error is considered corrupt and is not returned to the host.	BCH 40-bits/1KB ECC
Mean Time Between Failures (MTBF)   Mean Time Between Failures is estimated based on Telcordia methodology and demonstrated through Reliability Demonstration Test (RDT).	1,200,000 hours
Power On/Off Cycles   Power On/Off Cycles is defined as power being removed from the SSD, and then restored. Most host systems remove power from the SSD when entering suspend and hibernate as well as on a system shutdown.	24 per day
Insertion Cycles SATA/power cable insertion/removal cycles.   Data Retention The time period for retaining data in the NAND at maximum rated endurance.	50 on SATA cable 500 on backplane
	3 months power-off retention once SSD reaches rated write endurance at 40 °C
Endurance Rating   Based on JESD219 workload	60 GB: 32TBW 120 GB:70 TBW 240 GB: 140 TBW 500 GB: 300TBW while running JESD218 standard

 

2.3  Hot Plug Support

Hot Plug insertion and removal is supported in the presence of a proper connector and appropriate operating system (OS), as described in the SATA 3.0 specification.

This product supports asynchronous signal recovery and issues an unsolicited COMINIT when first mated with a powered connector to guarantee reliable detection by a host system without hardware device detection.

 

3.      Mechanical Information

SSD 2.5-inch Dimensions

X – Length	Y - Width	Z - Height
100.45 Max	69.85 +/- 0.25	7.0 +0/-0.5

   * - does not include 0.3 connector protrusion

 

4.      Pin and Signal Descriptions

 

4.1  Pin Locations

 

4.2  Pin Assignments

Pin#	Assignment	Description
1	GND	Return Current Path
2	RXP	SATA Differential RX+ based on SSD
3	RXN	SATA Differential RX- based on SSD
4	GND	Return Current Path
5	TXN	SATA Differential TX- based on SSD
6	TXP	SATA Differential TX+ based on SSD
7	GND	Return Current Path
8	N/A	N/A
9	N/A	N/A
10	N/A	N/A
11	GND	Return Current Path
12	GND	Return Current Path
13	GND	Return Current Path
14	V5	5 V Power
15	V5	5 V Power
16	V5	5 V Power
17	GND	Return Current Path
18	RSV	Device Activity Signal
19	GND	GND
20	N/A	N/A
21	N/A	N/A
22	N/A	N/A

NOTE: N/A means Reserved No connect on the device side.

4.3  Supported Command Sets

SSD supports all mandatory ATA (Advanced Technology Attachment) commands defined in the ATA8-ACS specification described in this section.

4.4  ATA General Feature Command Set

The SSD supports the ATA General Feature command set (nonPACKET), which consists of:

− EXECUTE DEVICE DIAGNOSTIC

− SET FEATURES

− IDENTIFY DEVICE

 

SSD also supports the following optional commands:

 

− READ DMA

− WRITE DMA

− READ SECTOR(S)

− READ VERIFY SECTOR(S)

− READ MULTIPLE

− SEEK

− SET FEATURES

− WRITE SECTOR(S)

− SET MULTIPLE MODE

 

− WRITE MULTIPLE

− FLUSH CACHE

− READ BUFFFER

− WRITE BUFFER

− NOP

− DOWNLOAD MICROCODE

− WRITE UNCORRECTABLE EXT

 

 

SSD supports the Power Management command set, which consists of:

− CHECK POWER MODE

− IDLE

− IDLE IMMEDIATE

− SLEEP

− STANDBY

5.      SMART Attributes

 

Attribute ID(hex)	Raw Attribute Value						Attribute Name
01	MSB	00	00	00	00	00	Read error rate
05	LSB	MSB	00	00	00	00	Reallocated sectors count
09	LSB			MSB	00	00	Reserved
0C	LSB	MSB	00	00	00	00	Power cycle count
A0	LSB			MSB	00	00	Uncorrectable sector count when read/write
A1	LSB	MSB	00	00	00	00	Number of valid spare block
A3	LSB	MSB	00	00	00	00	Number of initial invalid block
A4	LSB			MSB	00	00	Total erase count
A5	LSB			MSB	00	00	Maximum erase count
A6	LSB			MSB	00	00	Minimum erase count
A7	LSB			MSB	00	00	Average erase count
C0	LSB	MSB	00	00	00	00	Power-off retract count(Fujitsu:Emergency Retract Cycle Count)
C2	MSB	00	00	00	00	00	Controlled temperature
C3	LSB			MSB	00	00	Hardware ECC recovered
C4	LSB			MSB	00	00	Reallocation event count
C7	LSB	MSB	00	00	00	00	UltraDMA CRC error count
F1	LSB			MSB	00	00	Total LBAs written(each write unit = 32MB)
F2	LSB			MSB	00	00	Total LBAs read(each read unit = 32MB)

 

 

6.      Terms and Acronyms

 

Term	Definition
ATA	Advanced Technology Attachment
DAS	Device Activity Signal
DIPM	Device Initiated Power Management
DMA	Direct Memory Access
EXT	Extended
FPDMA	First Party Direct Memory Access
GB	Gigabyte (1,000,000,000 bytes) Note: The total usable capacity of the SSD may be less than the total physical capacity because a small portion of the capacity is used for NAND flash management and maintenance purposes.
HDD	Hard Disk Drive
HIPM	Host Initiated Power Management
I/O	Input/Output
IOPS	Input/Output Operations Per Second
KB	Kilobyte (1,024 bytes)
LBA	Logical Block Address
LPM	Link Power Management
MB	Megabyte (1,000,000 bytes)
MLC	Multi-level Cell
MTBF	Mean Time Between Failures
NCQ	Native Command Queuing
NOP	No Operation
PIO	Programmed Input/Output
RDT	Reliability Demonstration Test
RMS	Root Mean Squared
SATA	Serial Advanced Technology Attachment
SMART	Self-Monitoring, Analysis and Reporting Technology
SSD	Solid-State Drive
TYP	Typical
UBER	Uncorrectable Bit Error Rate

 

 

7.      Appendix A Command Set

	Command	Code	Protocol
	General Feature Set
	Execute Device Diagnostic	90h	Execute device diagnostic
	Flush Cache	E7h	Non-data
	Identify Device	ECh	PIO data-in
	Initialize Drive Parameters	91h	Non-data
	Read DMA	C8h	DMA
	Read Log Ext	2Fh	PIO data-in
	Read Multiple	C4h	PIO data-in
	Read Sector(s)	20h	PIO data-in
	Read Verify Sector(s)	40h or 41h	Non-data
	Set Feature	EFh	Non-data
	Set Multiple Mode	C6h	Non-data
	Write DMA	CAh	DMA
	Write Multiple	C5h	PIO data-out
	Write Sector(s)	30h	PIO data-out
	NOP	00h	Non-data
	Read Buffer	E4h	PIO data-in
	Write Buffer	E8h	PIO data-out
	Power Management Feature Set
	Check Power Mode	E5h or 98h	Non-data
	Idle	E3h or 97h	Non-data
	Idle Immediate	E1h or 95h	Non-data
	Sleep	E6h or 99h	Non-data
	Standby	E2h or 96h	Non-data
	Standby Immediate	E0h or 94h	Non-data
	Security Mode Feature Set
	Security Set Password	F1h	PIO data-out
	Security Unlock	F2h	PIO data-out
	Security Erase Prepare	F3h	Non-data
	Security Erase Unit	F4h	PIO data-out
	Security Freeze Lock	F5h	Non-data
	Security Disable Password	F6h	PIO data-out
SMART Feature Set
SMART Disable Operations		B0h	Non-data
SMART Enable/Disable Auto save		B0h	Non-data
SMART Enable Operations		B0h	Non-data
SMART Execute OFF-LINE Immediate		B0h	Non-data
SMART Read Log		B0h	PIO data-in
SMART Read Data		B0h	PIO data-in
SMART Read Threshold		B0h	PIO data-in
SMART Return Status		B0h	Non-data
SMART Save Attribute Values		B0h	Non-data
SMART Write Log		B0h	PIO data-out
Host Protected Area Feature Set
Read Native Max Address		F8h	Non-data
Set Max Address		F9h	Non-data
Set Max Set Password		F9h	PIO data-out
Set Max Lock		F9h	Non-data
Set Max Freeze Lock		F9h	Non-data
Set Max Unlock		F9h	PIO data-out
48-bit Address Feature Set
Flush Cache Ext		EAh	Non-data
Read Sector(s) Ext		24h	PIO data-in
Read DMA Ext		25h	DMA
Read Multiple Ext		29h	PIO data-in
Read Native Max Address Ext		27h	Non-data
Read Verify Sector(s) Ext		42h	Non-data
Set Max Address Ext		37h	Non-data
Write DMA Ext		35h	DMA
Write Multiple Ext		39h	PIO data-out
Write Sector(s) Ext		34h	PIO data-out
NCQ Feature Set
Read FPDMA Queued		60h	DMA Queued
Write FPDMA Queued		61h	DMA Queued
Others
Data Set Management		06h	DMA
Seek		70h	Non-data

 

 

 

8.      Appendix B Block Diagram

 

9.      Appendix C Controller Key Features

Host Interface

l  Industrial Standard SATA Revision 3.1 compliant

l  Industrial Standard ATA/ATAPI-8 and ACS2 command compliant

l  Supports SATA interface rate of 6 Gb/s (backward compatible to 1.5 Gb/s and 3 Gb/s)

l  Native Command Queuing up to 32 commands

l  SATA Device Sleep (DevSleep)

l  Data Set Management command (TRIM)

l  Self-Monitoring, Analysis, and Reporting Technology (S.M.A.R.T.)

l  Supports PHY Sleep mode (CFast PHYSLP)

l  Supports 28-bit and 48-bit LBA (Logical Block Addressing) mode commands

 

NAND Flash Support

l  Supports 4 channels of NAND flash devices with up to 8 Chip Selects per channel

l  Supports 1.8V/3.3V Flash I/O

l  ONFI 3.0 Synchronous/Asynchronous interface

l  Toggle 2.0 interface

l  EDO mode support

l  Supports 1x/1y/2x/2y/3xnm SLC and MLC

l  Supports 4KB, 8KB, and 16KB page size

l  Supports 1-plane, 2-plane, and 4-plane operation

DRAM Interface

l  16-bit wide DRAM interface

l  Supports DDR2/DDR3/DDR3L

 

Data Protection and Reliability

l  Supports ATA8 security feature set

l  Supports data security erase and quick erase

l  Hardware BCH ECC capable of correcting errors up to 66-bit/1KB

l  Internal data shaping technique increases data endurance

l  Global wear leveling algorithm evens program/erase count and maximizes SSD lifespan

l  Software/Hardware write protect option

l  StaticDataRefresh technology ensures data integrity

l  Early weak block retirement option

 

System

l  32-bit RISC CPU

l  High-efficiency 64-bit system bus

l  Automatic sleep and wake-up mechanism to save power

l  Built-in voltage detectors for power failure protection

l  Built-in power-on reset and voltage regulators

l  Built-in temperature sensor for SSD temperature detection

l  Supports JTAG emulator interface, bidirectional UART (RS-232) interface, and I2C master/slave

l  interface for on-system debug

 

Enhanced Security

l  Real time full drive encryption with Advanced Encryption Standard (AES)

l  Trusted Computing Group (TCG) Opal protocol

l  Hardware SHA 256 and True Random Number Generator (TRNG)

 

Operating Temperature

l  Commercial Grade: 0°C ~ 70°C

l  Industrial Grade: -40°C ~ +85°C

 

 

NVIKING's wide temperature technology

To ensure that all of its devices can be operated under even the harshest conditions, NVIKING utilizes wide temperature technology, allowing our flash and DRAM modules to operate and perform reliably in extreme temperatures.

NVIKING has implemented a proprietary wide temperature testing process to ensure the reliability of both its flash products and DRAM modules. Each product is tested in a Wide Temperature Cycle Chamber. Wide temperature products are those that have passed this rigorous internal test. Flash products and DRAM module put under extreme, rapidly changing temperatures in a Wide Temperature Cycle Chamber are subjected to the most stringent of testing conditions.

 

Underfill functions

Underfill provides a strong mechanical bond between key components and the underlying printed circuit board (PCB). By spreading stresses throughout the chip and PCB interface with a mechanical bond, less stress is concentrated on the solder joints, therefore increasing the reliability of the device. Underfill is commonly used for ball grid array (BGA) based storage for applications such as handheld devices, which are required to pass drop or tumble tests.

When a BGA device is exposed to repeated heating and cooling cycles, a BGA chip will expand or contract at a different rate compared to the underlying substrate on which it is mounted, due to the difference in each material's coefficient of thermal expansion. This differential creates a mechanical stress on the device’s solder joints. Underfill is then used as a stress relieving agent, evenly distributing the expansion and contraction effects and increasing device reliability.

 

How Underfill works

Underfill is typically a polymer or liquid epoxy that is applied to the perimeter of key components on a PCB after it has passed through a reflow oven. The PCB is then heated so that the underfill is absorbed underneath the key components via capillary action.

 

Advantages of SuperMLC

With just one bit of data per cell, NVIKING’s SuperMLC flash can speed up data access, offering sequential write speed up to twice faster than MLC flash chips. See Figure 2. In addition, SuperMLC flash is more reliable, more fault-tolerant and 10 times more durable than MLC, providing up to 30,000 Program/Erase (P/E) cycles*. SuperMLC increases the lifespan of SSD’s and memory cards, making it ideal for industrial and enterprise usages.

Intelligent Power Shield functions

Intelligent Power Shield (IPS) is a technology designed by NVIKING for DRAM SSDs operating at 5V to ensure the integrity of data transfer in the event of sudden power outage. By adding capacitors, IPS can prolong the time for data to complete the flushing process between a sudden power outage and the write protection mode. When power is on, these capacitors are charged so that during an unexpected power loss, the charged capacitors can continue offering power to the circuit, allowing more data to complete the writing process.

How does IPS work?

In cases of sudden power loss, the SSD stops accepting new write commands from the host at 4V and the voltage detector (VDT) triggers IPS. At this stage, IPS ensures the data stored in NAND are undamaged. The built-in capacitors continue to offer enough power for data to flush from DRAM cache into NAND flash. When the voltage drops below 2.3V, the NAND flash enters write protection mode and no more data can be written.

 

Coating Methods

Conformal coatings can be applied via a range of methods including manual brushing, manual spraying, dipping, or by automated spraying machines. NVIKING utilizes automated spraying machines for its conformal coating application due to their speed and accuracy. With automated spraying application, NVIKING is able to maintain a precise coating thickness with optimal results.

 

Coating Materials

Due to the wide range of applications that require conformal coatings, different materials—each having unique strengths and weaknesses—may be utilized. The coating, which encapsulates the entire printed circuit board (PCB), provides a physical barrier against moisture, dust, and other environmental contaminants. The most common coating materials are acrylic, silicone, urethane, and epoxy. Silicone and epoxy coatings can withstand exposure to high temperatures, while urethane has good chemical resistance. Acrylic coatings have excellent moisture and electrical resistance, and therefore are the preferred choice for the majority of applications.

NVIKING offers an acrylic conformal coating solution supplied by HumiSeal, one of the leading conformal coating manufacturers. The acrylic coating is quick–drying and features excellent flexibility, moisture protection, electrical isolation, and fungus resistance. It is also compliant with MIL, IPC, RoHS, and UL standards, and is well-suited to most applications. NVIKING also offers different coating materials for specific application needs.

 

NVIKING's Conformal Coating

NVIKING's conformal coating is applied directly to the module surface (except for the "gold-fingers") to completely encapsulate the PCB and all mounted components. The coating shields the DRAM or flash module from environmental factors, increasing the durability and reliability of the system.

 

To guarantee that NVIKING offers the highest quality embedded solutions, our coating process meets IPC-A-610D standards, which specify coating color, coverage, and thickness. Our coating material contains fluorescents to aid final inspection of the product. The coating is 100% inspected under UV light for distribution, quality, and uniformity.

 

AES functions

Defined by the National Institute of Standards and Technology (NIST) under the Federal Information Processing Standards Publication 197 (FIPS PUB 197), the Advanced Encryption Standard (AES) specifies a FIPS-approved cryptographic algorithm that can be used to protect electronic data.

 

The AES algorithm is a symmetric block cipher that can encrypt and decrypt data. Encryption converts data (plain-text) to an unintelligible form called cipher-text, while decryption converts this cipher-text back to the original plain-text. Cryptographic keys of 128, 192, or 256 bits may be used by the AES algorithm to encrypt and decrypt data in blocks of 128 bits.

 

NVIKING’s Hardware-Based AES Solution

NVIKING Information’s SSDs equipped with hardware-based AES encryption offer superior data protection and performance compared to competing offerings that utilize software-based or firmware-based encryption.

With hardware-based encryption, all data is encrypted before being stored in NAND Flash. After the encrypted data has been written into the flash, it becomes virtually impossible to decrypt the data without the original key. This ensures that critical data remains protected even in the unfortunate event of an SSD being stolen.

Performance is also improved compared to software-based solutions, since hardware-based encryption does not require system resources to perform the encryption/decryption process.

 

NVIKING Information offers a variety of SSDs equipped with hardware-based AES encryption for applications that handle sensitive data or require increased data security. From securing personal data, such as credit card information or medical records, to protecting sensitive corporate information, NVIKING Information’s SSDs with hardware-based AES encryption offer a complete data security solution.