DDR3 SDRAM

DDR3 is a high-performance solution for CPU systems—pushing the envelope in key areas like power consumption, signaling speeds, and bandwidth for desktop, notebook, and server computing. When you're ready to design in DDR3, we'll be here to help. As an industry leader, we are expertly equipped to help you sort through the technical details and recommend the best DDR3 solution for your application.

DDR3 SDRAM Module Solution

Performance

Memory and storage solutions that meet peak performance requirements.

Power Efficiency

Optimized energy efficiency that is key for next-generation supercomputers.

We offer modules solution not only manufacturing but also testing knowhow, by this way, save you lots of money and make the lowest investment for equipment. More important, you'll shorten the learning curve to phase in this market to avoid wasting time and money in trial and error.

Featured Products

We're Ready to Transfer Knowhow to your factory

To compete in growing country and cloud computing markets, you need significant power savings and performance advancements. Our solution has a rich set of features that address reliability, speed, power, and stacking capabilities—taking application performance to an entirely new level beyond other competitors.

Advantage

Cost Down

Using original packing and achieve same performance and quality as any high end brandy.

Few Investment

Our solution simplify test flow and programs saving your cycle time and no need too many test equipment for it.

Technical Transfer:e

We support you fully and it's free.

Capacity

Simulating with your planner and create the capacity plan together.t

Experience

Rich experience of mass production in China and we offer mutual solutions to you.

Reliability

Not only reliability but also compatibility are test completely, you totally trust our solution and you'll gain lots of knowhow and save time and money.

Intel-Validated Solutions

Our Solution has been validated in Intel's Haswell CPU architecture. The Haswell architecture, which uses a 22nm process node and a new X99 chipset, enables enterprise and cloud computing systems to take advantage of SDRAM Module solution considerable performance and power-saving enhancements.

Why Choose us?
• Time to market: We transfer mutual solution to you and we're sure the solution was mass production several times in China. All necessary test programs and knowhow are ready to support your specific needs.
• Rely on Us: We only offer in high-quality, reliable original packing products to you.
• Get Support: Team with us to receive the technical support by free. We are not just a supplier—we are your memory partner.

PCB

PCB Overview

PCB is a 0.738-inch high, 8 layers and DDR III 240 pins Unbuffer Low Profile DIMM PCB for PC and Server main memory applications. Description as below .

1. Support 128MB x8, 256MB x8, 512MB x8bits DDR III FBGA DRAM CHIPS 2 Ranks 256MB x64, 512MB x64, 1024MB x64bits organizations.

2. JEDEC Standard and single +1.5V (±0.1V) power &1.5V (SSTL_18 Compatible) I/O

3. Support DDR III SDRAM sealed in FBGA package and SPD with EEPROM in 8-Lead TSSOP & MLP8 TDFN-8 package.

4. Performance with PC3-8500 (DDR III-1066MHz), PC3-10660 (DDR III-1333MHz), PC3-12800 (DDR III-1600MHz)

5. Gold plated contacts.

Specification

NO	Item	Spec
1	Material	FR-4
2	Finished Board Thickness	1.27±0.1 mm
3	Au/Ni Thickness	Au : 2~3u / Ni: 100u
4	Line Width	4 mils ± 20%
5	Line Space	5 mils
6	Warp &Twist	<0.50 mm
7	Solderability Test	IPC-TM650
8	Solder Mask	Green( 0. 4mil )
9	PNL Size(mm * mm)	143.25 * 153.35 ± 0.1 mm
10	PCB Size(mm * mm)	18.75 * 133.35 ± 0.1 mm
11	Impedance	60 ohms ± 10%

Ball Pattern :

1	2	3		7	8	9
VDD	NU/RDQS-	VSS	A	VSSQ	DQS-	VDDQ
DQ6	VSSQ	DM/RDQS-	B	DQS	VSSQ	DQ7
VDDQ	DQ1	VDDQ-	C	VDDQ	DQ0	VDDQ
DQ4	VSSQ	DQ3	D	DQ2	VSSQ	DQ5
VDDL	VREF	VSS	E	VSSDL	CK	VDD
	CKE0	WE-	F	RAS-	CK-	ODT
BA2	BA0	BA1	G	CAS-	CS-
	A10	A1	H	A2	A0	VDD
VSS	A3	A5	J	A6	A4
	A7	A9	K	A11	A8	VSS
VDD	A12	NC/A14	L	NC/A15	A13
1	2	3		7	8	9